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    Powering the Next 

    Era of Semiconductor
    Innovation
    Maximizing performance and energy efficiency with semiconductor
    & system design, custom ASIC turnkey & embedded solutions
0+ years
Deep expertise in analog, mixed-signal, and digital design — across 180nm to 2nm nodes
0+ ASIC
Turnkey silicon solutions delivered across power management, RF, and signal processing
0M+ chips
High-reliability ASICs shipped annually to global OEMs and Tier-1s

Designing Tomorrow's Semiconductor Solutions Together

Cyient delivers custom ASICs and semiconductor design services, optimizing performance, power efficiency, and reliability with high-precision solutions tailored to industry needs.

With a strong legacy in engineering excellence and a proven track record in semiconductor development, we empower sectors across industries with custom silicon solutions that optimize performance, power efficiency, and integration.

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Semiconductor solutions
from concept to silicon

From initial design to full-chip production, Cyient delivers high-performance semiconductor solutions tailored to industry needs. Whether accelerating chip development or providing turnkey ASIC solutions, we enable businesses to integrate custom silicon seamlessly and efficiently.

Semiconductor 

Design Services

Helping semiconductor companies accelerate chip design with:

  • System Architecture & Design
  • Analog Mixed Signal Design
  • Layout and Verification
  • Digital Design and Verification
  • Physical Design and Signoff
  • Design for Test (DFT)
  • Post Silicon Validation
  • Board Design
  • Layout and Manufacturing
  • ATE Test Program Development and Testing
  • Embedded Software & Firmware Development

ASIC Turnkey 

Solutions

Full-chip development from concept to production, enabling OEMs to integrate custom silicon into their products without in-house expertise.

  • Custom ASIC design
  • Prototyping and testing
  • Packaging and assembly
  • Manufacturing and supply chain
  • End-to-end support

How we design tomorrow
together

Group 1320

Complete ownership. Seamless collaboration

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Complete ownership. Seamless collaboration

End-to-end ASIC development with unified ownership and no vendor gaps.

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Global teams. Local advantage.

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Global teams. Local advantage.

Execution hubs across India, Europe, and the US—global scale with local presence.

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Fabless model for scalable solutions

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Fabless model for scalable solutions

Trusted foundries, OSATs, and IP partners for faster ramp, lower cost, and flexibility.

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Start ahead with proven IP

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Start ahead with proven IP

Pre-verified analog, digital, and mixed-signal IPs—no reinvention, no delay.

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Tested, validated, production-ready

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Tested, validated, production-ready

ATE and silicon validation labs across EU and India ensure production-grade reliability.

Group 1324

Built right. Built to last.

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Built right. Built to last.

ISO systems, multi-tier checks, and continuous improvement ensure long-term reliability.

Co-creating value

with  foundries, OSATs,  EDA  and
IP providers

Success in action

Frame 601 - 2025-04-03T142920.010
Optical Network Infrastructure ASIC

Cyient designed a high-speed 3nm ASIC for coherent optical communication. This ASIC enables big data processing in metro, campus, and data center interconnects and balances latency and throughput for modern applications.

Frame 601 - 2025-04-03T142931.525
LED Driver Array for Industrial Printers

Designed an advanced LED driver array using TSMC 0.18µm technology, enhancing performance and efficiency in industrial printing with precise current control and on-chip diagnostics.

Frame 601 - 2025-04-03T142941.643
MEMS Read-Out ASIC for a Novel Contact Lens Sensor

Cyient developed an ASIC that directly integrates into a contact lens, enabling the early detection of glaucoma. This innovative solution demonstrates Cyient's expertise in creating miniaturized, power-efficient chips for medical wearable devices.

Frame 601 - 2025-04-03T142951.332
India's First 5G Narrowband IoT Chip

Cyient designed an IoT SoC featuring a narrowband IoT USIM interface, integrated PMU, and GPS for precise location tracking. Its versatile digital core and multiple interfaces suit smart-tech applications like wearables, home automation, and fleet management.

Frame 601 - 2025-04-03T143005.214
Laser Driver for Automotive LIDAR

Designed a multi-channel laser driver with ultra-short (1 ns) pulsed laser capability for Automotive LiDAR, achieving peak current at 50 A with ASIL-B safety compliance. Optimizes object detection and safety in autonomous vehicles.

Powering the future of 
SEMICONDUCTORS

From silicon to systems, we deliver customized semiconductor solutions to help
businesses build a smarter, more connected, and energy efficient future.