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  • Group 1339 Partners_Mobile (1)
    ASIC TURNKEY
    SOLUTIONS
    Looking for a custom semiconductor solution?
    We handle everything — from spec to silicon

Embrace next-gen product innovation with custom ASIC development 

We deliver end-to-end custom ASIC solutions—from analog mixed signal (AMS) to digital and RF to FinFET —backed by full lifecycle support. Our turnkey approach helps businesses accelerate product development, reduce costs, and gain a competitive edge without the complexity of having in-house semiconductor engineering teams. With our ASIC turkey offerings we are committed to catering to the rising demand for high-performance, power-efficient, and secure chips.

How we deliver custom ASICs

From concept to production – the Cyient ASIC journey

Feasibility
Group 1340
Feasibility

Analyze requirements and define key specifications to build the optimal ASIC solution.

Defining Chip
Architecture
Group 1341-1
Defining Chip
Architecture

Develop a robust chip architecture that optimizes power, performance, and cost considerations.

Development
/Prototyping
Group 1342 (1)
Development
/Prototyping

Create complete logic, power management, and signal processing functions, followed by prototyping to ensure capability.

Qualification
Group 1343
Qualification

Validate the chip against industry standards and compliance requirements to ensure robustness and readiness for mass production.

Validation
/Optimization
Group 1344
Validation
/Optimization

Perform end-to-end testing and optimization to enhance chip performance, efficiency, and reliability.

Fabrication
/Packaging
Group 1345
Fabrication
/Packaging

Manufacture silicon wafers, package chips, and ensure durability & protection for operational environments via partners.

Manufacturing
at Scale
Group 1346-1
Manufacturing
at Scale

Manage production through trusted fab partners, ensuring consistent quality and timely delivery.

Supply Chain
Management
Group 1348
Supply Chain
Management

Streamline logistics and material handling, coordinating the entire supply chain for seamless delivery.

Lifecycle Support
& Enhancements
Group 1349
Lifecycle Support
& Enhancements

Offer ongoing support, upgrades, and optimizations to keep the ASIC solution future-ready.

The Cyient advantage

Why choose Cyient ASIC Turnkey Solutions

Group 1320

Full lifecycle support

Group 1320-1
Full lifecycle support

We provide extensive support, from initial concept to post-production enhancements

Group 1321

Specialized in Analog Mixed Signal ASICs

Group 1321-1
Specialized in Analog Mixed Signal ASICs

Decade-long expertise in Analog & Mixed-Signal ASIC design for high-performance applications

Group 1322

Fabless model partnerships

Group 1322-1
Fabless model partnerships

Strong collaborations with leading foundries, OSATs, EDA, IP Providers to deliver top-tier semiconductor solutions

Group 1328

Design Centers & Test/Validation Infra

Group 1328-1
Design Centers & Test/Validation Infra

Seven design centers, in-house test infrastructure, Post Silicon Validation lab, and ATE Test labs in Germany, Belgium, & India

Group 1325

Strong IP Portfolio

Group 1325-1
Strong IP Portfolio

Multiple reusable in-house IPs and TSMC Secure rooms enabling access to technologies, including 3nm

Group 1327

EU & India Location Advantage

Group 1327-1
EU & India Location Advantage

Presence in Belgium, Germany, UK, Netherlands, India, US, Japan, & Taiwan, with cost-efficient, high-quality engineering talent

Success in action

How we’ve helped businesses create value with our silicon expertise

Frame 601 (20)
High Precision GPS Receiver for ADAS

Developed a millimeter-accurate GPS receiver for autonomous driving, with LNA, PLL, and 7th-order filter integration. AEC-Q100 certified and tested on NI-STS, with in-house ramp-up of the first 100K units. Built on TSMC 65nm with IATF16949 compliance.

Frame 601 (21)
LED Driver Array ASIC with LVDS Interface for Digital Printer

Created a 198-LED driver array with an LVDS interface and 8-bit DAC control. Integrated fault diagnostics and optimized for ATE testing. Wafer tests conducted using Teradyne J750EX.

Frame 601 (22)
NFC ASIC 13.56 MHz with No EM Filter

Designed a single-supply NFC ASIC with integrated PA and receiver that removes the need for an EM filter. Includes robust power management. Ramp-up of 500K units with production on NI-STS and V93K.

Frame 601 (23)
India’s First 5G Narrow-Band IoT Chip

Established an SoC with NB-IoT, uSIM, PMU, and GPS, tailored for smart applications like wearables and fleet management.

Frame 601 (24)
400MHz Satellite Transceiver for Wildlife Tracking

Delivered a low-power, satellite-enabled transceiver for wildlife tracking. It supports a 2800 km range and features a DSP modem and ESA-compliant design.

Frame 601 (25)
High-performance ASIC for water meter

Built an ultrasound transceiver on TSMC 0.18µm CMOS with ultra-low noise TIA and temperature sensing. Enables precise flow and energy metering across utility sectors.

Need specialized
ASIC support?

Talk to our experts