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  • Group 1295 (2) Partners_Mobile-1
    Communications
    and 5G
    Shaping the future of Communications and 5G
    with tailored chip solutions

As telecom networks scale to meet the demands of 5G and beyond, the silicon behind them must do more—support higher speeds, lower latency, and greater energy efficiency. Cyient Semiconductors brings deep expertise in RF front-end design, high-speed data processing, and power-optimized architectures to help advance these goals. From public safety radio to nanosatellite systems, our custom silicon is engineered to meet the performance realities of next-gen communication infrastructure.

Custom silicon for every layer
of communication

Group 1297

5G base stations

Group 1360
5G base stations

High-performance RF and analog ASICs for wireless signal management

Group 1302

Nanosatellites & GPS

Group 1361
Nanosatellites & GPS

Low-power, high-precision chips for LEO/MEO satellites and advanced positioning

Group 1303

Enterprise LAN and cellular infrastructure

Group 1362
Enterprise LAN and cellular infrastructure

Ethernet LAN switch infrastructure, cellular/RAN infrastructure

Group 1359

Public safety communication

Group 1363
Public safety communication

Secure, mission-critical ASICs for emergency radio networks

Group 1305

Network infrastructure

Group 1364
Network infrastructure

ASICs for optical networking, high-speed data transfer, and edge computing

Group 1307

Advanced broadband and access network technologies

Group 1366
Advanced broadband and access network technologies

Broadband access solutions, ATM, SONET/SDH access

Group 1306

Wireless connectivity and communication

Group 1365
Wireless connectivity and communication

WLAN, Bluetooth, GPS, mobile TV, NFC, broadcast radio, ZigBee, and UWB

Group 1367

Cellular technologies

Group 1368
Cellular technologies

4G and 5G cellular technologies

Group 1309

Home networking & connectivity

Group 1369
Home networking & connectivity

Cable modems, CPE devices, HomePNA, G.Hn, MoCA

Success in action

How we’ve helped communication industry leaders

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India's first 5G narrowband IoT chip

Cyient designed an IoT SoC featuring a narrowband IoT front-end uSIM interface, integrated PMU, and GPS for precise location tracking. Its versatile digital core and multiple interfaces suit smart-tech applications like wearables, home automation, and fleet management.

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3nm ASIC for optical network infrastructure

Cyient developed a 3nm ASIC optimized for coherent optical communication, enabling big data processing in metro, campus, and Data Center Interconnects. The solution ensures   balance latency, throughput, and fault tolerance.

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ARGOS satellite transceiver for wildlife tracking

Created using TSMC 0.18µm CMOS technology, the ARGOS transceiver enables continuous, reliable tracking of wildlife and environmental data in challenging conditions, supporting the evolving needs of satellite-based telecom networks.

From design to silicon:
full-spectrum semiconductor expertise

Custom semiconductor design and turnkey ASIC solutions crafted for communications.

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Semiconductor
Design

Fast-tracking chip development for advanced networks

Custom silicon engineered for RF front-ends, baseband processing, and data-plane acceleration—enabling high-speed, power-efficient semiconductors for advanced network infra. Solutions optimised for throughput, latency, and integration, supporting next-gen connectivity across 5G, satellite, broadband, and enterprise systems.
Explore Semiconductor Design
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ASIC Turnkey Solutions

Custom ASICs for optimized network performance

Turnkey ASIC development from architecture and RTL to prototyping and production, supporting OEMs & Tier-1s building high-speed, energy-efficient network hardware. These solutions enhance signal integrity, reduce system complexity, and ensure long-term silicon availability.
Explore ASIC Turnkey Solutions

Need advanced chips for connected
networks? 

Talk to our experts