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  • Group 1295 (1) Partners_Mobile (2)
    SEMICONDUCTOR
    DESIGN
    Looking for a design partner? We accelerate
    chip development with expert engineering support

Semiconductor design innovation accelerated

We offer comprehensive semiconductor design services spanning analog mixed-signal (AMS), and digital domains. With decades of experience, our expertise covers front-end and back-end design, verification, and IP development. We are positioned to serve fabless semiconductor companies, IDMs, system integrators, semicon startups, Tier 1s, and OEMs across multiple sectors.

End-to-end design
expertise for quality chips 

System Architecture & Design
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Designing chip architectures optimized for speed, power consumption, and scalability, ensuring a seamless transition from concept to silicon with industry-standard compliance.

Analog Mixed-Signal Design
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Our expertise spans high-speed ADCs, DACs, PLLs, and power management circuits, delivering high-performance mixed-signal solutions for complex applications.

Layout and Verification
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Creating optimized chip layouts that ensure manufacturability while adhering to process constraints. Our verification methodologies reduce design iterations, enhancing efficiency.

Digital Design and Verification
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We offer RTL design, functional verification, and FPGA prototyping, enabling high-performance digital circuits with robust power and timing optimization.

Physical Design and Signoff
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Our expertise in placement, routing, and timing closure ensures DRC/LVS-clean layouts that meet PPA (power, performance, and area) targets for successful silicon realization.

Design for Test (DFT)
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Integrating scan chains, boundary scan, and MBIST/ LBIST methodologies, ensuring efficient testing, fault coverage, and yield optimization.

Post-Silicon Validation
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Validating performance under real conditions, conducting debugging, power analysis, and compliance testing to ensure production readiness.

Board Design, Layout, and Manufacturing
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Designing high-speed, multilayer PCBs, optimizing signal integrity and power efficiency while ensuring smooth manufacturing workflows.

ATE Test Program Development and Testing
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Developing Automated Test Equipment (ATE) programs for comprehensive functional and parametric testing, ensuring quality and yield at volume manufacturing.

Embedded Software & Firmware Development
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Our firmware and software solutions enhance chip efficiency, enabling seamless integration and system-level performance optimization.

The Cyient Advantage

Layer_1-3

Tapeout-proven, production-ready

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Tapeout-proven, production-ready

Expertise across analog, digital, and mixed-signal — analog at 350–40nm and digital SoCs from 40nm to 2nm

Vector (5)

Custom IP, tailored integration

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Custom IP, tailored integration

RF, power, sensor, and memory IP blocks — silicon-proven and optimized for seamless SoC integration.

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Flow-compatible, stack-ready

Group 1386
Flow-compatible, stack-ready

Native compatibility with Synopsys, Cadence, Siemens, and proprietary flows — ready to plug into your ecosystem.

Layer_1 (1)

Flexible models, structured execution

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Flexible models, structured execution

RTL to GDSII support — with flexible CoE-led execution, phase-level handoffs, or full-flow ownership.

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Globally connected, locally agile

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Globally connected, locally agile

Real-time collaboration from India with nearshore engineering in Europe and the US — enabling seamless execution.

Success in action

How we’ve helped semiconductor leaders

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PMIC for high-performing automotive apps

Designed a robust PMIC for automotive infotainment, compliant with ASIL-B and AEC-Q100 Grade II. Integrated high-efficiency regulators, I2C interface, OTP memory, watchdog, and safety circuits for reliable in-vehicle power management.

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Optical network infrastructure ASIC - 3nm

Delivered a 3nm ASIC enabling 800Gbps data transfer across 8000 km. Integrated high-speed digital, memory, and ARM M7 cores for metro/data center interconnects, verified via FPGA before ASIC production.

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Datacenter networking chip at TSMC 3nm-16nm

Executed RTL-to-GDS design for multi-node networking chips on TSMC 3nm/5nm/7nm/16nm. Led complex SoC block ownership, low-power strategy, and timing closure for scalable, high-performance datacenter applications.

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Laser driver for automotive LIDAR

Built a 50A, 1 ns pulsed multi-channel laser driver using 130nm ULP tech. Integrated charge caps on-die with equidistant diodes, designed for ASIL-B and ISO26262-compliant LiDAR systems.

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EPC Gen2 RFID UHF reader

Created a fully integrated RFID reader IC with ARM M0+, modem, and UHF transceiver. Optimized for low-noise, high-linearity performance in fixed/mobile RFID applications using TSMC 55nm tech.

Need specialized
semiconductor design support?