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SEMICONDUCTOR
DESIGNLooking for a design partner? We accelerate
chip development with expert engineering support
Semiconductor design innovation accelerated
We offer comprehensive semiconductor design services spanning analog mixed-signal (AMS), and digital domains. With decades of experience, our expertise covers front-end and back-end design, verification, and IP development. We are positioned to serve fabless semiconductor companies, IDMs, system integrators, semicon startups, Tier 1s, and OEMs across multiple sectors.
End-to-end design
expertise for quality chips
System Architecture & Design
Designing chip architectures optimized for speed, power consumption, and scalability, ensuring a seamless transition from concept to silicon with industry-standard compliance.
Analog Mixed-Signal Design
Our expertise spans high-speed ADCs, DACs, PLLs, and power management circuits, delivering high-performance mixed-signal solutions for complex applications.
Layout and Verification
Creating optimized chip layouts that ensure manufacturability while adhering to process constraints. Our verification methodologies reduce design iterations, enhancing efficiency.
Digital Design and Verification
We offer RTL design, functional verification, and FPGA prototyping, enabling high-performance digital circuits with robust power and timing optimization.
Physical Design and Signoff
Our expertise in placement, routing, and timing closure ensures DRC/LVS-clean layouts that meet PPA (power, performance, and area) targets for successful silicon realization.
Design for Test (DFT)
Integrating scan chains, boundary scan, and MBIST/ LBIST methodologies, ensuring efficient testing, fault coverage, and yield optimization.
Post-Silicon Validation
Validating performance under real conditions, conducting debugging, power analysis, and compliance testing to ensure production readiness.
Board Design, Layout, and Manufacturing
Designing high-speed, multilayer PCBs, optimizing signal integrity and power efficiency while ensuring smooth manufacturing workflows.
ATE Test Program Development and Testing
Developing Automated Test Equipment (ATE) programs for comprehensive functional and parametric testing, ensuring quality and yield at volume manufacturing.
Embedded Software & Firmware Development
Our firmware and software solutions enhance chip efficiency, enabling seamless integration and system-level performance optimization.
The Cyient Advantage
Tapeout-proven, production-ready
Tapeout-proven, production-ready
Expertise across analog, digital, and mixed-signal — analog at 350–40nm and digital SoCs from 40nm to 2nm
Custom IP, tailored integration
Custom IP, tailored integration
RF, power, sensor, and memory IP blocks — silicon-proven and optimized for seamless SoC integration.
Flow-compatible, stack-ready
Flow-compatible, stack-ready
Native compatibility with Synopsys, Cadence, Siemens, and proprietary flows — ready to plug into your ecosystem.
Flexible models, structured execution
Flexible models, structured execution
RTL to GDSII support — with flexible CoE-led execution, phase-level handoffs, or full-flow ownership.
Globally connected, locally agile
Globally connected, locally agile
Real-time collaboration from India with nearshore engineering in Europe and the US — enabling seamless execution.
Success in action
How we’ve helped semiconductor leaders
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PMIC for high-performing automotive apps
Designed a robust PMIC for automotive infotainment, compliant with ASIL-B and AEC-Q100 Grade II. Integrated high-efficiency regulators, I2C interface, OTP memory, watchdog, and safety circuits for reliable in-vehicle power management.
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Optical network infrastructure ASIC - 3nm
Delivered a 3nm ASIC enabling 800Gbps data transfer across 8000 km. Integrated high-speed digital, memory, and ARM M7 cores for metro/data center interconnects, verified via FPGA before ASIC production.
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Datacenter networking chip at TSMC 3nm-16nm
Executed RTL-to-GDS design for multi-node networking chips on TSMC 3nm/5nm/7nm/16nm. Led complex SoC block ownership, low-power strategy, and timing closure for scalable, high-performance datacenter applications.
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Laser driver for automotive LIDAR
Built a 50A, 1 ns pulsed multi-channel laser driver using 130nm ULP tech. Integrated charge caps on-die with equidistant diodes, designed for ASIL-B and ISO26262-compliant LiDAR systems.
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EPC Gen2 RFID UHF reader
Created a fully integrated RFID reader IC with ARM M0+, modem, and UHF transceiver. Optimized for low-noise, high-linearity performance in fixed/mobile RFID applications using TSMC 55nm tech.