<iframe src="https://www.googletagmanager.com/ns.html?id=GTM-KQ3FZBL" height="0" width="0" style="display:none;visibility:hidden">
Skip to content
  • Group 1295 (1) Partners_Mobile (2)
    SEMICONDUCTOR
    DESIGN
    SERVICES
    Looking for a design partner? We accelerate
    chip development with expert engineering support

Semiconductor design innovation accelerated

We offer comprehensive semiconductor design services spanning analog mixed-signal (AMS), and digital domains. With decades of experience, our expertise covers front-end and back-end design, verification, and IP development. We are positioned to serve fabless semiconductor companies, IDMs, system integrators, semicon startups, Tier 1s, and OEMs across multiple sectors.

End-to-end design
expertise for quality chips 

System Architecture & Design
Mask group(2)-1

Designing chip architectures optimized for speed, power consumption, and scalability, ensuring a seamless transition from concept to silicon with industry-standard compliance.

Analog Mixed-Signal Design
Mask group

Our expertise spans high-speed ADCs, DACs, PLLs, and power management circuits, delivering high-performance mixed-signal solutions for complex applications.

Layout and Verification
Mask group (1)

Creating optimized chip layouts that ensure manufacturability while adhering to process constraints. Our verification methodologies reduce design iterations, enhancing efficiency.

Digital Design and Verification
Mask group (4)

We offer RTL design, functional verification, and FPGA prototyping, enabling high-performance digital circuits with robust power and timing optimization.

Physical Design and Signoff
Mask group (3)

Our expertise in placement, routing, and timing closure ensures DRC/LVS-clean layouts that meet PPA (power, performance, and area) targets for successful silicon realization.

Design for Test (DFT)
Mask group (5)

Integrating scan chains, boundary scan, and MBIST/ LBIST methodologies, ensuring efficient testing, fault coverage, and yield optimization.

Post-Silicon Validation
Mask group (7)

Validating performance under real conditions, conducting debugging, power analysis, and compliance testing to ensure production readiness.

Board Design, Layout, and Manufacturing
Mask group (8)

Designing high-speed, multilayer PCBs, optimizing signal integrity and power efficiency while ensuring smooth manufacturing workflows.

ATE Test Program Development and Testing
Mask group (9)

Developing Automated Test Equipment (ATE) programs for comprehensive functional and parametric testing, ensuring quality and yield at volume manufacturing.

Embedded Software & Firmware Development
Mask group (10)

Our firmware and software solutions enhance chip efficiency, enabling seamless integration and system-level performance optimization.

The Cyient Advantage

Success in action

How we’ve helped semiconductor leaders

Frame 601 (26)
PMIC for high-performing automotive apps

Designed a robust PMIC for automotive infotainment, compliant with ASIL-B and AEC-Q100 Grade II. Integrated high-efficiency regulators, I2C interface, OTP memory, watchdog, and safety circuits for reliable in-vehicle power management.

Frame 601 (27)
Optical network infrastructure ASIC - 3nm

Delivered a 3nm ASIC enabling 800Gbps data transfer across 8000 km. Integrated high-speed digital, memory, and ARM M7 cores for metro/data center interconnects, verified via FPGA before ASIC production.

Frame 601 (28)
Datacenter networking chip at TSMC 3nm-16nm

Executed RTL-to-GDS design for multi-node networking chips on TSMC 3nm/5nm/7nm/16nm. Led complex SoC block ownership, low-power strategy, and timing closure for scalable, high-performance datacenter applications.

Frame 601 (29)
ASIC for DNA sequencing application

Developed a custom ASIC with multi-million detection points for real-time DNA sequencing. Included data pre-processing hardware and high-speed sensor interface for precise diagnostics.

Frame 601 (30)
Laser driver for automotive LIDAR

Built a 50A, 1 ns pulsed multi-channel laser driver using 130nm ULP tech. Integrated charge caps on-die with equidistant diodes, designed for ASIL-B and ISO26262-compliant LiDAR systems.

Frame 601 (31)
EPC Gen2 RFID UHF reader

Created a fully integrated RFID reader IC with ARM M0+, modem, and UHF transceiver. Optimized for low-noise, high-linearity performance in fixed/mobile RFID applications using TSMC 55nm tech.

Need specialized
semiconductor design support?