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    Power Line Communication for
    Automotive
    Digital data communication over existing DC power lines

Modern trucks and trailers rely on continuous data exchange for safety, control, and diagnostics. Running additional cabling between units increases cost, weight, and complexity - so manufacturers increasingly depend on power line communication (PLC) to transmit data across existing DC power lines.

To support this requirement, Cyient Semiconductors provides a fully custom automotive PLC chip that seamlessly retrofits into legacy hardware. The solution delivers reliable communication, reduced chip area, and automotive-grade robustness while remaining fully pin-compatible with existing ASSP devices.

At the core of connected industry

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Smart metering (gas/water/electricity)

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Smart metering (gas/water/electricity)

Secure, low-power communication for real-time utility monitoring

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Time-of-flight
for robotics

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Time-of-flight
for robotics

Precision sensing for navigation and obstacle detection in automation

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Lighting, building automation, and HVAC

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Lighting, building automation, and HVAC

Fire detection, CCTV/video surveillance cameras, intruder alarm, thermostats & controls

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NFC and RFID systems

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NFC and RFID systems

Seamless smart infrastructure integration with telecom expertise

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Encoders for robotics

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Encoders for robotics

High-precision motion control for automation and industrial robotic applications

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Test equipment

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Test equipment

Automated test equipment for semiconductors, digital multimeters, network analyzers, digital oscilloscopes

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Factory automation & control

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Factory automation & control

Flow, level, pressure, and temperature measurement

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Motor drives

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Motor drives

AC variable speed drives, DC drives, servo drives, stepper drives, soft starters/brakes

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Power & energy

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Power & energy

AC/DC supplies, converters, inverters, battery chargers, UPS, generators, and renewable energy (hydro/solar/wind)

Success in action

How we’ve helped leaders in Industry 4.0 and robotics

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LED driver array for industrial printers

Designed an advanced LED driver array using TSMC 0.18µm technology, enhancing industrial printing with precise current control and on-chip diagnostics.

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Laser distance measurement system for Industry 4.0

Developed a System-on-Chip (SoC) for laser distance measurement with precise laser driver pulse steering and a Transimpedance Amplifier (TIA) photodiode front end, achieving accurate distance measurements for automation and manufacturing.

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High precision GPS receiver

Designed a high-precision GPS receiver using TSMC 65nm technology, ensuring accurate location tracking even in challenging environments, enabling applications like surveying and asset tracking.

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Smart metering with acoustic front end

Developed an ultra-sound transceiver using TSMC 0.18µm CMOS technology for accurate flow metering and acoustic sensing, enabling precise water, heat, and electricity usage measurement in smart meters.

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High-performance EPC Gen2 RFID UHF reader

Developed a highly integrated RFID reader IC suitable for fixed and mobile applications. The complete UHF radio transceiver is integrated on-chip, including the digital modem and an ARM Cortex M0+ core. The design features a low-noise, high-linearity optimized receiver to support backscattering communication, ensuring reliable performance in diverse environments.

From design to silicon:
full-spectrum semiconductor expertise

Custom semiconductor design and turnkey ASIC solutions, built for Industry 4.0 and robotics

SDS Fulll bleed card

The requirements

The design introduces several demanding constraints, including:

  • Communication over existing truck–trailer power lines
  • Full pin compatibility with an obsolete ASSP (without available design data)
  • Compliance with AEC-Q100 Rev.G, EMC, ESD, and Schaffner pulse standards
  • ASIL-B suitability for automotive safety systems
  • Reduced silicon area and cost
  • Clean, resilient communication in noisy electrical environments
  • Support for legacy protocols using newly developed lab tools
These requirements ensure that the new chipset integrates effortlessly into existing systems while maintaining full automotive reliability.
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Bringing the solution to life

Cyient Semiconductors developed a custom, drop-in compatible chipset engineered specifically for automotive PLC. The design includes a complete mixed-signal chain, embedded control logic, and verification platforms to support rapid integration into customer boards.

Key Features:
  • 8-bit DAC operating at 3 MSps
  • Output amplifier with 6 mA drive strength
  • Correlated double-sampling comparator for enhanced noise immunity
  • Integrated UART-based controller with ROM
  • Custom lab setup and FPGA boards to emulate and validate the legacy protocol
By combining precision mixed-signal design with automotive-qualified robustness, the solution enables reliable data transfer across the same wiring used to deliver power -simplifying installation and reducing hardware overhead.

Where it’s used today

The PLC chipset supports a wide range of truck–trailer communication functions and is present in:

•    Existing braking and ABS systems
•    Trailer control modules
•    Diagnostic data links
•    Retrofitted power-line-based communication systems

Its compatibility and reduced footprint make it ideal for manufacturers updating legacy platforms without redesigning entire assemblies.

Need specialized silicon for
industrial automation? 

Talk to our experts